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Introduction to MEMS

MEMS Design and Fabrication

MEMS Application

Introduction to MEMS Sensors

Introduction MEMS accelerometer.

MEMS Gyro

RF MEMS

Silicon MEMS

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Introduction to MEMS full pdf 60 pages
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Introuction to MEMS ?

What is MEMS ?

Microelectromechanical systems (MEMS) refer to devices that have characteristic length of less than 1 mm but more than 1 micron, that combine electrical and mechanical components, and that are fabri- cated using integrated circuit batch-processing technologies. Current manufacturing techniques for MEMS include surface silicon micro machining; bulk silicon micromachining; lithography, electro- deposition, and plastic molding; and electro discharge machining. The multi disciplinary field has witnessed explosive growth during the last decade and the technology is progressing at a rate that far exceeds that of our understanding of the physics involved. Electrostatic, magnetic, electromagnetic, pneumatic and thermal actuators, motors, valves, gears, cantilevers, diaphragms, and tweezers of less than 100 micron size have been fabricated. These have been used as sensors for pressure, temperature, mass flow, velocity, sound and chemical composition, as actuators for linear and angular motions, and as simple components for complex systems such as robots, lab-on-a-chip, micro heat engines and micro heat pumps. The lab- on-a-chip in particular is promising to automate biology and chemistry to the same extent the integrated circuit has allowed large-scale automation of computation. Global funding for micro- and nanotechnology research and development quintupled from $432 million in 1997 to $2.2 billion in 2002. In 2004, the U.S. National Nanotechnology Initiative had a budget of close to $1 billion, and the worldwide invest- ment in nanotechnology exceeded $3.5 billion. In 10 to 15 years, it is estimated that micro- and nano- technology markets will represent $340 billion per year in materials, $300 billion per year in electronics, and $180 billion per year in pharmaceuticals.

Topics which I would like to cover are:-
MEMS: Introduction and Fundamentals
MEMS: Design and Fabrication
MEMS: Applications
The development and deployment of NEMS and MEMS are critical to the U.S. economy and society because nano- and micro technologies will lead to major breakthroughs in information technology and computers, medicine and health, manufacturing and transportation, power and energy systems, and avionics and national security. NEMS and MEMS have important impacts in medicine and bioengineering (DNA and genetic code analysis and synthesis, drug delivery, diagnostics, and imaging), bio and information technologies, avionics, and aerospace (nano- and micro scale actuators and sensors, smart reconfigurable geometry wings and blades, space-based flexible structures, and microgyroscopes), automotive systems and transportation (sensors and actuators, accelerometers), manufacturing and fabrication, public safety, etc. During the last years, the government and the high-technology industry have heavily funded basic and applied research in NEMS and MEMS due to the current and potential rapidly growing positive direct and indirect social and economic impacts.
Nano- and microengineering are the fundamental theory, engineering practice, and leading-edge technologies in analysis, design, optimization, and fabrication of NEMS and MEMS, nano- and microscale structures, devices, and subsystems. The studied nano- and microscale structures and devices have dimensions of nano- and micrometers. To support the nano- and microtechnologies, basic and applied research and development must be performed. Nanoengineering studies nano- and microscale-size materials and structures, as well as devices and systems, whose structures and components exhibit novel physical (electromagnetic and electromechanical), chemical, and biological properties, phenomena, and -10 processes.


FUTURE The 1980s to the mid 1990s saw the development of three categories of fabrication technologies for MEMS. Bulk micromachining, sacrificial surface micromachining, and LIGA have unique capabilities based on the fabrication materials utilized, ability to integrate with electronics, assembly, and thickness of materials.


Today’s automobile is one area in which the world of MEMS has a direct impact on daily life. A number of locations within the automobile contain MEMS technology, for example: • Accelerometers are used for multiple functions, such as air bag deploy- ment, vehicle security, and seat belt tension triggers. • Gyroscopes are used — possibly in conjunction with accelerometers — in car stability control systems to correct the yaw of a car before this becomes a problem for the driver. • Pressure sensors: the manifold absolute pressure sensor is used to control the fuel–air mixture in the engine. Tire pressure monitoring has also been recently mandated for use in automobiles. • The wheel speed sensor is a component of the ABS braking system that can also be used as an indirect measure of tire pressure. • The oil condition sensor detects oil temperature, contamination, and level.

The field of Nanotechnology, which aims at exploiting advances in the fabrication and controlled manipulation of nanoscale objects, is attracting worldwide attention. This attention is predicated upon the fact that obtaining early supremacy in this field of miniaturization may well be the key to dominating the world economy of the 21st century and beyond. NanoMEMS exploits the convergence between nanotechnology and microelectromechanical systems (MEMS) brought about by advances in the ability to fabricate nanometer-scale electronic and mechanical device structures. Indeed, the impact of our ability to make and control objects possessing dimensions down to atomic scales, perhaps first considered by the late Richard Feynman in his 1959 talk “There is Plenty of Room at the Bottom” is expected to be astounding . In particular, miniaturization, he insinuated, has the potential to fuel radical paradigm shifts encompassing virtually all areas of science and technology, thus giving rise to an unlimited amount of technical applications. Since high technology fuels the prosperity of the world’s most developed nations, it is easy to see why the stakes are so high.

This line of development is closely related to the field of quantum devices/nanoelectronics, which was prompted by the conception of a number of atomic-level deposition and manipulation techniques, in particular, molecular beam epitaxy (MBE), originally exploited to construct laboratory devices in which the physics of electrons might be probed and explored, following the discovery of electron tunnelling in heavily-doped pn -junctions . Nanoelectronics did produce interesting physics, for instance, the discovery of Coulomb blockade phenomena in single-electron transistors, which manifested the particle nature of electrons, and resonant tunnelling and conductance quantization in resonant tunnelling diodes and quantum point contacts, respectively, which manifested the wave nature of electrons . These quantum devices, in conjunction with many others based on exploiting quantum phenomena, generated a lot excitement during the late 1980s and early 1990s, as they promised to be the genesis for a new digital electronics exhibiting the properties of ultra-high speed and ultra-low power consumption . While efforts to realize these devices helped develop the skills for fabricating nanoscale devices, and efforts to analyze and model these devices helped to develop and mature the field of mesoscopic quantum transport, the sober reality that cryogenic temperatures would be necessary to enable their operation drastically restricted their commercial importance. A few practical devices, however, did exert commercial impact, although none as much as that exerted by silicon IC technology, in particular, heterojunction bipolar transistors (HBTs), and high-electron mobility transistors (HEMTs), which exploit the conduction band discontinuities germane to heterostructures, and modulation doping to create 2-D electron confinement and quantization, respectively, and render devices superior to their silicon counterparts for GHz-frequency microwave and low-transistor- count digital circuit applications .

The commercial success of the semiconductor industry, and its downscaling program, motivated emulation efforts in other disciplines, in particular, those of optics, fluidics and mechanics, where it was soon realized that, since ICs were fundamentally two-dimensional entities, techniques had to be developed to shape the third dimension, necessary to create mechanical devices exhibiting motion and produced in a batch planar process . These techniques, which included surface micromachining, bulk micromachining, and wafer bonding, became the source of what are now mature devices, such as accelerometers, used in automobile air bags, and pressure sensors, on the one hand, and a number of emerging devices, such as, gyroscopes, flow sensors, micromotors, switches, and resonators, on the other. Coinciding, as they do, with the dimensional features germane to ICs, i.e., microns, these mechanical devices whose behavior was controlled by electrical means, exemplified what has come to be known as the field of microelectromechanical systems (MEMS).

Three events might be construed as conspiring to unite nanoelectronics and MEMS, namely, the invention of a number of scanning probe microscopies, in particular, scanning tunneling microscopy (STM) and atomic force microscopy (AFM), the discovery of carbon nanotubes (CNTs), and the application of MEMS technology to enable superior RF/Microwave systems (RF MEMS) . STM and AFM, by enabling our ability to manipulate and measure individual atoms, became crucial agents in the imaging of CNTs and other 3-D nanoscale objects so we could both “see” what is built and utilize manipulation as a construction technique. CNTs, conceptually, two-dimensional graphite sheets rolled-up into cylinders, are quintessential nanoelectromechanical (NEMS) devices, as their close to 1- nm diameter makes them intrinsically quantum mechanical 1-D electronic systems while, at the same time, exhibiting superb mechanical properties. MEMS, on the other hand, due to their internal mechanical structure, display motional behavior that may invade the domain of the Casimir effect, a quantum electrodynamical phenomenon elicited by a local change in the distribution of the modes in the zero-point fluctuations of the vacuum field permeating space . This effect which, in its most fundamental manifestation, appears as an attractive force between neutral metallic surfaces, may both pose a limit on the packing density of NEMS devices, as well as on the performance of RF MEMS devices .

NanoMEMS fabrication technologies extend the capabilities of conventional integrated circuit (IC) processes, which are predicated upon the operations of forming precise patterns of metallization and doping (the controlled introduction of atomic impurities) onto and within the surface and bulk regions of a semiconductor wafer, respectively, with the performance of the resulting devices depending on the fidelity with which these operations are effected.

Microengineering and Microelectromechanical systems (MEMS) have very few watertight definitions regarding their subjects and technologies. Microengineering can be described as the techniques, technologies, and practices involved in the realization of structures and devices with dimensions on the order of micrometers. MEMS often refer to mechanical devices with dimensions on the order of micrometers fabricated using techniques originating in the integrated circuit (IC) industry, with emphasis on silicon-based structures and integrated microelectronic circuitry. However, the term is now used to refer to a much wider range of microengineered devices and technologies. There are other terms in common use that cover the same subject with slightly different emphasis. Microsystems technology (MST) is a term that is commonly used in Europe. The emphasis tends towards the development of systems, and the use of different technologies to fabricate components that are then combined into a system or device is more of a feature of MST than MEMS, where the emphasis tends towards silicon technologies.






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